Honor and Oppo are preparing to launch their latest flagship smartphones from the Magic 6 and Find X7 series respectively. A new leak has revealed some potential features that could be present in these high-end devices.
According to a well-known tipster, Digital Chat Station, both smartphone series will come with a mini chipset for satellite communication technology, proprietary low power calling tech, and heat dissipation for improved performance. The low power calling feature is expected to serve as an emergency contact method in conjunction with satellite communication. The heat dissipation technology will help prevent thermal throttling, thereby ensuring sustained high performance even when using powerful chips like the Snapdragon 8 Gen 3 on the Magic 6 series.
Interestingly, the tipster has reiterated their claim that the Oppo Find X7 series will also have satellite communication capabilities. Additionally, both the Honor Magic 6 and Oppo Find X7 series might feature high-end image technology, as per the tipster’s information.
Based on current information, the Find X7 is expected to be equipped with the MediaTek Dimensity 9300, while the Find X7 Pro will come with the Qualcomm Snapdragon 8 Gen 3 SoC.
These rumored features suggest that both Honor and Oppo are focused on delivering cutting-edge technology and enhanced performance in their upcoming flagship smartphones. Fans of these brands can look forward to the official launch to learn more about the full range of features and specifications offered by the Magic 6 and Find X7 series.